ARBURG GmbH + Co KG 台湾支社 (アーブルグ 台湾支社)

The Silicon Photonics Supply Chain Is Taking Shape: Where Precision Injection Molders Fit In

Silicon photonics and Co-Packaged Optics (CPO) enter their market adoption phase from 2026 — and the resulting demand extends well beyond semiconductor chips themselves. Fiber-optic connectors, optical transceiver housings, and precision structural components are driving a parallel surge in demand for high-precision plastic parts. For precision injection molders, the key to entering this supply chain lies not in manufacturing capability, which most already possess, but in whether their production equipment and process systems can pass the supplier qualification audits of high-tech customers. This article examines the opportunity from three angles: market trends, entry strategy, and the equipment response.